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DI-SORIC索瑞克高性能光幕OLGSP 12/12
更新时间：2017-05-08 点击次数：626次
di-soric高性能光幕用于安全检测晶片上的硅碎片，和检测双层晶片。可以在生产过程中尽早检测出有缺陷的晶片材料，以降低次品率。本系列光幕可以通过适配器调节以检测不同尺寸的晶片。由于本系列光幕的紧凑型设计，它可以安装在狭窄的空间。坚固的金属外壳和高防护等级都是它的特点。高性能光幕Reliable detection of double layers and fragments larger 10 mmElectronic potentiometer for adjusting wafer thickness and fragment sizeInput for switching between wafer sizes 125 mm and 156 mm
Metal casingHigh protection class
Detection of fragments larger 15 mm
Electronic potentiometer for adjusting wafer thickness and fragement size
Input for switching between wafer sizes 125 mm and 156 mm
Small size for mounting between two belts
Metal casing
High protection class
| TECHNICAL INFORMATION (typ.) | +20°C, 24V DC |
|---|---|
| Size | 55 x 166 x 8 mm (Dimensions) |
| Number of beams | 12 |
| Emitted light | Infrared, clocked |
| Service voltage | 24 V DC + 10 % polarity-safe |
| Internal power consumption | 130 mA |
| Working distance | ≤ 50 mm Transmitter / Receiver (recommended) |
| Detection width | 156 / 125 mm switchable via pin selection "detection widths" |
| Penetrable wafer thickness | ≤ 300 μm (mono poly-crystalline silicium wafer material) |
| Transmitting power | 0…100 % digitally adjustable |
| Ambient temperature | +5 … +40 °C |
| Ambient light immunity | 50 kLx |
| Protection class | IP 67 |
| Protection degree | III, operation on protective low voltage |
| Casing material | Aluminium black anodized |
| Connection | Kabel PU 2,5m with connector M8, 3-polig |
